Deep access wedge bonder

Application:

Special for deep access bonding design in wire bonding. Reach depth about 20mm pending.

Specification:

1,electric requirement：220VAC±10％、50HZ、60W be sure connected to ground

2,wire diameter：25～50µm

3,ultrasonic power：0－3W, 60kHz, two channel. can be set separately of the two point

4,bond time：5－200ms，two channel

5,bond force:10－60g，two channel

6, span between first bond to second bond by automatic mode:0-10mm(motorized)

7,bond radian: 0-6mm(motorized)

8, jig moving area: Φ16mm

9,mouse hand:20*20mm

10,digital camera: optional

11,dimension:600*560*390mm weight:36kg