Bond pull tester

Introduction:

This pull tester is designed for testing the pull strength of the wire and the push strength of the gold ball on the chip and the die bonding strength(COB).

Specification：

※ Dimension：350mm*400mm*500mm

※ Power in：220V

※ Power:5W

※ Microscope：15/30X OR 20/40X

※ Push strength range：0-5000G（accuracy: 0.001KG）Meter brand：SP

※ Pull strength range：0-30G（accuracy:1G）Meter brand：DESK

※ Jig:depend on product(standard jig: COB, DIP,SMD,High power LED)

※ Precision lead screw：stroke:200MM

※ Micrometer：0-25MM（2 pcs）

※ Precision slide：4PCS

※ Weight:30kg

Operation:

1,put the product to the jig;

2,adjust the meters to zero;

3, under the microscope, turn the hand wheel slowly, so to push the product to close to the meters;

4, align the probe or hook on the meter to the gold ball or wire.

5, turn the micrometer slowly, the meter can get a value of the strength. be careful of the strength range of the meter!