Manual wire bonder

Application
Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.

Specification

1,electric requirement：220VAC±10％、50HZ、be sure connected to ground

2,wire diameter：25～75μm
3,ultrasonic power：0－3W, 60kHz, two channel. can be set separately of the two point
4,bond time：5－200ms，two channel
5,bond force:10－60g，two channel
6, span between first bond to second bond by automatic mode:0-10mm(motorized)
7,bond radian: 0-6mm(motorized)
8, jig moving area: Φ16mm
9,mouse hand:20*20mm
10,digital camera: optional
11,dimension:600*560*390mm
12,weight:36kg