Heavy wire bonder

Application:

High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3、TO-3P、TO-3PF、TO-3PN、TO-3PL、TO-220F、TO-126、TO-12F、TO-66、TO-251、TO-202 etc.

Specification

1,electric requiement：220VAC±10％、50HZ、be sure connected to ground

2,aluminium wire diameter：75～500μm (3～20mil)

3,ultrasonic power：0－30W, two channel.can be set separately of the two point

4,bond time：10－500ms，two channel

5,bond force:30－1200g，two channel

6,motorized Y：0－18mm

7,microscope rate：7.5 and 15

8,working area：Φ25mm

9,light：adjustable brightness

10,size：620×610×560mm

11,weight：~40kg