ID wafer Slicer

Designed for automatically slicing semiconductor material, glass, ceramic, lithium tantalite and lithium columbate and other hard or fragile materials.

Main Features Spindle unit： It adopts vertical spindle design. It uses radial ball bearing to increase the rigidity, precision and life. Its vibration is small. Worktable unit Worktable use high precision linear guideway an AC servo system. The range of speed is wide and the low speed performance is better. It can satisfy requirements of different materials. Feeding unit Feeding system uses step motor and driving system to improve stability and precision.

MACEX-QP-613B

□Maximal Diameter of Cutting Ingot: ￠153mm

□Blade Standard:￠690mm×￠241mm×0.15mm or ￠690mm× ￠235mm×0.15mm

□Maximal Length of Cutting Ingot:400mm

□Cutting speed:0.2〜99mm/min □Return Speed:1〜1000mm/min

□The speed of main spindle:1420r/min

□Stepping deviation of feeding :±0.005mm(testing with l mm feeding step)

□Range of Wafer Thickness:0.001〜68.00mm

□Adjustment only of Crystal Direction:0.001mm

□Adjustment of Crystal Direction: Horizontal range（x）±7°（resolution：2') Vertical range（Y）±7º（resolution：2'）

□ Power：3.5kw,〜380v±38v, 50HZ±1HZ

□Source of Air：0.4〜0.5MPa,250L/min(instantaneous flux when braking)

□Sour of cooling water:0.2〜0.4mpa;5L/min

□Touching Panel： 7.7inch

□Dimension:645mm×925mm×2820mm

□Weight:2500kg